Assignors: MARTIN, KEVIN P., MEINDL, JAMES D., MULE, TONY, BAKIR, MUHANNAD, KOHL, PAUL, THACKER, HIREN, GAYLORD, THOMAS K. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority claimed from US36544302P external-priority Application filed by Georgia Tech Research Corp filed Critical Georgia Tech Research Corp Priority to US10/390,873 priority Critical patent/US7554347B2/en Assigned to GEORGIA TECH RESEARCH CORPORATION reassignment GEORGIA TECH RESEARCH CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Original Assignee Georgia Tech Research Corp Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) Martin Paul Kohl Current Assignee (The listed assignees may be inaccurate. ( en Inventor Tony Mule′ Hiren Thacker Muhannad Bakir James D. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Expired - Fee Related, expires Application number US10/390,873 Other versions US20040017215A1
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Google Patents High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of useĭownload PDF Info Publication number US7554347B2 US7554347B2 US10/390,873 US39087303A US7554347B2 US 7554347 B2 US7554347 B2 US 7554347B2 US 39087303 A US39087303 A US 39087303A US 7554347 B2 US7554347 B2 US 7554347B2 Authority US United States Prior art keywords optoelectronic probe card waveguide optical optical component Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US7554347B2 - High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use Whether you are looking to invest in your lab, test floor, portfolio or career, we have more information for you here.US7554347B2 - High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use Learn More Sales & ServiceĬontact us today to learn about our products and services, or find a representative in your area to answer your sales and support questions. Follow the link below for a snapshot of some of the industries we support. Learn More IndustriesįormFactor products ensure the quality and reliability of ICs used in electronics affecting every aspect of our lives.
Learn More Applicationsįrom the engineering lab to the production test floor, FormFactor’s products enable a wide range of test and measurement applications. From chip-scale to wafer probing systems, cryostats and magnetometry systems to contract test services, our solutions meet the most challenging requirements. Learn More Enabling TechnologyįormFactor offers a range of cryogenic test and measurement solutions to quantum engineers. Learn More Enabling TechnologyįormFactor's FRT metrology engineers designed SurfaceSens technology to achieve superior information about the measured sample and greater insights about product quality. Of engineering probes to meet the highly demanding requirementsĭurable, high-performance that exceeds expectations. FormFactor uses MEMS to build millions of tiny robust electrical springs capable of testing ICs over more than a million contact cycles. MEMS probes are the integral elements of our advanced wafer probe cards.
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Learn More Enabling TechnologyįormFactor’s Contact Intelligence combines smart hardware design, innovative software algorithms and years of experience to optimize probe contact accuracy on-wafer - enabling true, autonomous test. We offer a complete line of premium performance analytical probe stations for on-wafer probing that help increase process performance while reducing cost of ownership.
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